• AEHR TEST SYSTEMS is a leading producer of test and burn-in equipment.
  AEHR TEST SYSTEMS is a leading producer of test and burn-in equipment. The company develops, manufactures and sells systems that are designed to reduce the cost of testing Dynamic Random Access Memories (DRAMS) and other integrated circuits (ICs), perform reliability screening (burn-in) of complex logic and memory ICs, and enable IC manufacturers to perform test and burn-in of bare die. With more than 2,000 systems installed worldwide, AEHR TEST has set the standards for the test and burn-in since 1977.
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• Amkor Technology: IC Assembly Semiconductor Test Wafer Level Packaging
  Amkor Technology is the world's leading supplier of outsourced semiconductor interconnect services. With over 35 years of continuous improvement, growth and innovation, Amkor has become a trusted partner for most of the world’s leading semiconductor suppliers.
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• Amkor: Flip Chip Packaging | FlipChip Packaging | Flip Chip Package | FC Packaging
  Amkor is committed to being the leading provider of Flip Chip in Package (FCiP/flipchip/flip-chip) technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. Amkor has a fully qualified wafer bumping facility in our K4 factory in Korea. SuperFC™ and fcCSP have been qualified and in production for over two years in the P3 facility in the Philippines.
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• Credence Systems Corporation - Welcome
  Credence Systems - leading supplier of automatic test equipment (ATE) serving the global semiconductor industry with a wide range of test solutions for digital, mixed-signal and memory products.
  Credence Systems - leading supplier of automatic test equipment (ATE) serving the global semiconductor industry with a wide range of test solutions for digital, mixed-signal and memory products.
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• ESEC
  ESEC is a leading global provider of chip assembly equipment and system solutions for the semiconductor industry. The company's core business activities is die attach (Die Bonder, Flip Chip Bonder) and wire bonding.
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• GDA Technologies Inc., a leading Electronic Design Services (EDS) Provider
  
  GDA Technologies is a leading Electronic Design Services (EDS) and Silicon Intellectual Property (SIP) solution provider for the Embedded, Networking, and Consumer Electronics Markets, 10 G Mac/1G Mac, SPI 4. Fully synthesizable RTL box, verification environment, FPGA prototype platform.
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• Micron Technology
  Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, Flash memory, CMOS image sensors, other semiconductor components and memory modules for use in leading-edge computing, consumer, networking, and mobile products.
  Micron Technology offers DRAM components, modules, and NAND Flash memory.
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